Last edited by Shalabar
Sunday, July 12, 2020 | History

4 edition of Area array packaging handbook found in the catalog.

Area array packaging handbook

by Ken Gilleo

  • 49 Want to read
  • 26 Currently reading

Published by McGraw-Hill in New York .
Written in English

    Subjects:
  • Ball grid array technology.,
  • Microelectronic packaging.

  • Edition Notes

    Includes bibliographical references and index.

    StatementKen Gilleo.
    SeriesMcGraw-Hill packaging and electronics books, McGraw-Hill handbooks
    Classifications
    LC ClassificationsTK7870.15 .G54 2002, TK7870.15 .G54 2002
    The Physical Object
    Pagination1 v. (various pagings) :
    ID Numbers
    Open LibraryOL18168308M
    ISBN 100071374930
    LC Control Number2001041051

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    The next big innovation was the area array package, which places the interconnection terminals throughout the surface area of the package, providing a greater number of connections than previous package types where only the outer perimeter is used. The first area array package was a ceramic pin grid array package. Not long after, the plastic ball grid array (BGA), another type of area array. In area-array packaging, the surface of the chip has an array of solder interconnects (solder bumps) that are joined to a substrate when the chip is flipped over (flip-chip packaging). 3 The interconnects can then be fanned-out through the package to another area-array geometry on the bottom of the package called a ball-grid array (BGA). 4 An.


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Area array packaging handbook by Ken Gilleo Download PDF EPUB FB2

The Area Array Packaging Handbook brings you the details you need on this rapidly expanding field in microelectronics packaging. Filled with hands-on, leading edge information engineers need for day-to-day decision making, Area Array Packaging Handbook is an unbeatable resource for success in today's fast-paced world of by: *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI) Table of contents Forword Section 1: Packaging Concepts and Design.

Area array packaging handbook. [Ken Gilleo] -- "Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC).

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Area array packaging handbook. New York: McGraw-Hill, (OCoLC) Online version: Gilleo, Ken. Area array packaging handbook. New York: McGraw-Hill, (OCoLC) Material Type: Internet resource: Document Type: Book.

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Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and.

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Microelectronic packaging has been recognized as an important "enabler" for the solid­ state revolution in electronics which we have witnessed in the last third of the twentieth century.

Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their. Area Array Interconnection Handbook Karl J. Puttlitz, Paul A.

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